1-25T-WAFER-2-12P
1.25mm Pitch SMT Wafer Connector Header 2-12P Full Range, Housing & Terminal Wire-to-Board Kit
1.25mm pitch SMT wafer header available 2-12P, supplied with housing and tin-plated brass terminals as a set for PCB-to-wire connection.
JINDA's 1.25mm pitch SMT wafer system covers the full 2P to 12P range, with board-side SMT headers paired with housings and tin-plated brass crimp terminals. PA66 nylon body, tin-plated brass contacts, SMD leads for reflow soldering, and a full pole range for one-stop selection. Used in LED lighting, appliances, security, industrial control, automotive and consumer electronics. ODM/OEM supported on poles, color and packaging.
Specifications
| MOQ | MOQ 1000pcs |
|---|---|
| Type | Type SMT Wafer Header + Housing + Crimp Terminal Kit |
| Pitch | Pitch 1.25mm |
| Poles | Poles 2P-12P (full range optional) |
| Series | Series 1.25T SMT Wafer 2-12P |
| Material | Material PA66 Nylon + Tin-Plated Brass |
| Lead Time | Lead Time 7-15 days |
| Logistics | Logistics DHL/UPS/FedEx |
| ODM & OEM | ODM & OEM Supported |
| Packaging | Polybag + Carton |
| Current Rating | Current Rating 1A (inferred) |
| Voltage Rating | Voltage Rating 50V (inferred) |
| Place of Origin | Place of Origin Dongguan, Guangdong, China |
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