1-25T-7-GH-1-25MM
1.25mm Pitch GH-Compatible SMT Wafer Header with Housing & Crimp Terminal Kit 7P 1.25T-7(GH)
1.25mm pitch GH-compatible SMT wafer header kit with housing and tin-plated brass crimp terminals, 7P, for board-to-wire connections.
JINDA 1.25T-7(GH) is a 1.25mm pitch GH-compatible wire-to-board system: an SMT board-side wafer header paired with housing and tin-plated brass crimp terminals. It offers reliable contact, easy SMT soldering, a polarized latch housing and stable mating feel. Used for internal wire-to-board connections in LED lighting, home appliances, security monitoring, industrial control, automotive electronics and consumer electronics. JINDA supports ODM/OEM customization on pole count, color and packaging.
Specifications
| MOQ | MOQ 1000pcs |
|---|---|
| Type | Type SMT Wafer Header + Housing + Crimp Terminal Kit |
| Pitch | Pitch 1.25mm |
| Poles | Poles 7P |
| Series | Series 1.25T-7(GH) GH-Compatible |
| Material | Material PA66 Nylon + Tin-Plated Brass |
| Lead Time | Lead Time 7-15 days |
| Logistics | Logistics DHL/UPS/FedEx |
| ODM & OEM | ODM & OEM Supported |
| Packaging | Polybag + Carton |
| Current Rating | Current Rating 1A (inferred) |
| Voltage Rating | Voltage Rating 50V (inferred) |
| Place of Origin | Place of Origin Dongguan, Guangdong, China |
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